TMS Divisions:

Test & Measurement Embedded Systems   Distribution

Upcoming Events 

To view previous Webinars, please visit our Application Notes & Videos Page

                                            

 

PCI Express Gen3, Gen4 and Gen5 Physical Layer Test Requirements and Procedures


When: Thursday, December 14, 2017

Time: 11:00 AM EST

REGISTER HERE

Sponsored by: Anritsu & Teledyne LeCroy

Overview:
PCI Express testing can be a daunting prospect; physical-layer testing requires tools with sophisticated protocol-aware capabilities at transfer rates of 8, 16, and up to 32 Gb/s. Anritsu and Teledyne LeCroy provide compliance test coverage with industry-leading signal generation, physical- and protocol-layer analysis and Bit Error Ratio measurement technology.

This webinar will equip engineers with an understanding of the test specifications, detailed test procedures, and optimal test equipment configurations to ensure their products pass PCI Express compliance testing.

Please note: By registering for this webinar, the details of your profile may be used by Signal Integrity Journal™, the presenter and the sponsor to contact you by email.

Speakers:

Hiroshi Goto - Business Development Manager at Anritsu
Hiroshi Goto has over 25 years of experience as a high speed and optical Engineer at Anritsu Company holding a variety of positions including Design Engineer, Product Marketing Engineer and currently high speed and optical Product Manager and Business Development Manager. Mr. Goto holds a Bachelor’s degree in Physics from Aoyama Gakuin University. He resides in the Dallas area and has authored numerous industry application notes and white papers and frequently speaks on the topic of signal integrity.
 

Patrick Connally - Technical Marketing Engineer at Teledyne LeCroy
Patrick Connally joined Teledyne LeCroy in 2013, and works as a Technical Marketing Engineer specializing in high-bandwidth oscilloscopes. He received his PhD in Electrical and Electronic Engineering from Queen's University Belfast in 2006, and has been working in the test and measurement industry since 2009.
 

 

Low Frequency Passive and High Frequency Active Probing Techniques and Tradeoffs - What to Use and Why


When: Available on Demand

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Abstract:

Connectivity, system bandwidth, rise time, and probe location must be carefully considered when probing any target. In addition, the non-ideal probe exhibits parasitic effects that interact with the DUT and can pollute the measurement if not managed properly.

Engineers must commonly probe low and high frequency signals with high signal fidelity. Typical passive probes with high input impedance and capacitance provide good response at lower frequencies, but inappropriately load the circuit and distort signals at higher frequencies. 

Join Teledyne LeCroy for this webinar as we discuss: 
  • Selecting the right probing techniques to maximize the accuracy of your measurements
  • Probe specifications and their implications on the measured signal
  • Variety of probes and accessories available for measurement
  • Virtual probing software tools that allow the user to probe the signal when direct access is physically impossible

 

Presenter: Mark Lionbarger, Field Applications Engineer

 

 

Oscilloscope Automation and Making Custom Measurements Using MATLAB and VB


When: Available on Demand

REGISTER HERE

 

Abstract:

 

This webinar focuses on fast and easy methods to enhance functionality by incorporating custom routines and user-defined algorithms directly into the scope processing path. 

Topics covered will include: Scripting, custom math and measurement examples using MATLAB, Visual Basic Script, Excel Math, C++, and Visual Basic for Applications, combining in-line user-written algorithms and built-in oscilloscope algorithms, dynamic automation, user-defined interfaces, embedding algorithms into panel setups, measurements and math operators, in-line real-time decisions, peak finding, custom filters, inverse FFT, dynamic searching, COM automation and remote control using MATLAB and Visual Basic.
 

Presenter: Mike Hertz, Sr. Field Applications Engineer, Teledyne LeCroy

Cost: Free

 

 

Easy Data Center Testing up to 100Gbps


When: Available On Demand

Duration: 19 minutes


REGISTER HERE

Abstract:
Increased copper & fiber optic cabling within Data Centers drive client installation and verification demands.  Data Center Operations struggle to install, verify and troubleshoot client connections and Data Center Interconnects deployed daily in expanding data centers that require a hand-held, all-in-one tool for testing and troubleshooting at all data rates, using any given interface, located anywhere in the data center. 

 

This brief presentation describes the capabilities and ease of use of the Anritsu MT1x00A Network Master Series for copper and fiber cable testing and verification in one-step.

 
 

Presented by Danny Gonzalez - Optical Transport Business Development Manager at Anritsu Company. Daniel Gonzalez possesses over 16 years’ experience in digital and optical transport testing, development, training and execution spanning technologies including TDM, SONET, OTN, ATM, Carrier Ethernet and Physical Layer Signal Integrity.

 

As an Optical Transport Business Development Manager for Anritsu Company, Daniel is responsible for providing technical support to sales, marketing & customers in North & South America. Daniel holds a B. S. in Telecommunications Management from DeVry University,          is a member of OIF (Optical Internetworking Forum) Networking & Operations Working Group (WG), member of IEEE Communications Society (ComSoc) & has his MEF (Metro Ethernet Forum) Carrier Ethernet 2.0 Professional Certification. He also has several of his articles published in Lightwave, ISE Magazine, Mission Critical and Pipeline publications.